• Epoxy Molding Compounds Thermal Interface Materials
  • Epoxy Molding Compounds Thermal Interface Materials
  • Epoxy Molding Compounds Thermal Interface Materials
  • Epoxy Molding Compounds Thermal Interface Materials
  • Epoxy Molding Compounds Thermal Interface Materials
  • Epoxy Molding Compounds Thermal Interface Materials

Epoxy Molding Compounds Thermal Interface Materials

CAS No.: 1344-28-1
Formula: Al2O3
EINECS: 215-691-6
Material: Al2O3
Structure Feature: White Powder
Type: Chemical
Samples:
US$ 0/kg 1 kg(Min.Order)
| Request Sample
Customization:
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  • Overview
  • Product Description
  • Application
Overview

Basic Info.

Model NO.
AT-HC-1
Usage
Chemical Industry Product
Effect
Used Fororganic Silicon and /Thermal Conductivity
Source
Alumina
Appearance
White Powder
Al2O3
99.3min
Sio2
0.1max
Fe2o3
0.04max
Transport Package
25kg/PP Woven Bag, 1t/Jumbo Bag
Specification
99.8%min
Trademark
Aotai
Origin
P. R. China
HS Code
2818200000
Production Capacity
30000tons/Year

Product Description

Epoxy Molding Compounds Thermal Interface Materials
Product Description

High Thermal Conductivity Filler Alumina

Overview: The product has spherical, near spherical and angular compact crystal structure, has good dispersion, good interface compatibility with organic polymer materials, can meet the requirements of high filling volume;The product has narrow particle size distribution, high chemical purity, good thermal conductivity and insulation performance, and the product quality has been recognized by customers at home and abroad.
Application: The products are mainly used in organic silicon and epoxy polymer materials, such as thermal insulating silicone sheet (pad), thermal silicone grease, silicone oil and epoxy potting adhesive, thermal double-sided tape, thermal plastic, electronic packaging, etc.
 
Epoxy Molding Compounds Thermal Interface Materials
High thermal conductivity spherical alumina QX series
 
-High sphericity, can meet the requirements of high filling   quantity
-The particle size distribution is narrow
-High chemical purity, low electrical conductivity
 
 
Application

Epoxy Molding Compounds Thermal Interface Materials



Epoxy Molding Compounds Thermal Interface Materials
Epoxy Molding Compounds Thermal Interface Materials


Epoxy Molding Compounds Thermal Interface Materials
Epoxy Molding Compounds Thermal Interface Materials
Epoxy Molding Compounds Thermal Interface Materials

FAQ
Q: Are you factory?
A: Yes, we are factory.
Q: How is your quality?
A: We have top grade production equipment and precision measuring instruments and we also have engineers and technicians  carry out quality control.
Q: Can you supply free samples?
A: 1kgs free sample is available, but freight charges will be at your account, The charges will be  return to you or deduct from your  order in the future.
Q: What about the payment?
     100% T/T in advance, 30% T/T in advance, the balance 70% against the B/L copy, Irrevocable L/C at sight
Q: The MOQ is?
A: MOQ is usually 1 ton, special products can be coordinuted with each other.
Q: Can I visit your factory?
A: Yes, we welcome you to visit our factory at anytime
Q: How about your delivery time?
A: Usually the shipment is within 15 days after confirming receipt of your payment, some products maybe need longer time.


  


 

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Diamond Member Since 2020

Suppliers with verified business licenses

Manufacturer/Factory & Trading Company
Number of Employees
20
Year of Establishment
2017-04-07