Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1

Product Details
Customization: Available
Usage: Chemical Industry Product
CAS No.: 1344-28-1
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Number of Employees
20
Year of Establishment
2017-04-07
  • Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1
  • Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1
  • Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1
  • Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1
  • Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1
  • Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1
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  • Overview
  • Product Description
  • Application
Overview

Basic Info.

Model NO.
AT-HC-1
Einecs
215-691-6
Material
Al2O3
Structure Feature
White Powder
Type
Chemical
Effect
Used Fororganic Silicon and /Thermal Conductivity
Source
Alumina
Appearance
White Powder
Transport Package
25kg/PP Woven Bag, 1t/Jumbo Bag
Specification
99.8%min
Trademark
Aotai
Origin
P. R. China
HS Code
2818200000
Production Capacity
30000tons/Year

Product Description

Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1
Product Description

High Thermal Conductivity Filler Alumina

Overview: The product has spherical, near spherical and angular compact crystal structure, has good dispersion, good interface compatibility with organic polymer materials, can meet the requirements of high filling volume;The product has narrow particle size distribution, high chemical purity, good thermal conductivity and insulation performance, and the product quality has been recognized by customers at home and abroad.
Application: The products are mainly used in organic silicon and epoxy polymer materials, such as thermal insulating silicone sheet (pad), thermal silicone grease, silicone oil and epoxy potting adhesive, thermal double-sided tape, thermal plastic, electronic packaging, etc.
 
Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1
High thermal conductivity spherical alumina QX series
 
-High sphericity, can meet the requirements of high filling   quantity
-The particle size distribution is narrow
-High chemical purity, low electrical conductivity
 
 
Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1
High thermal conductivity near- spherical alumina LQ series
- Spherical compact crystal structure, smooth particle               surface, high conversion, can meet the requirements of high filling quantity
- The particle size distribution is narrow
- High chemical purity, low electrical conductivity

 
 
Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1
High thermal conductivity Angle alumina JX series
- Granular compact crystal structure, high conversion, good interface compatibility with organic polymer materials
-  The particle size distribution is narrow
- High chemical purity, low electrical conductivity

 
 
Application
 

Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1



Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1
Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1


Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1
Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1
Thermal Conductivity Filler Used in EMC Ccl CAS 1344-28-1

FAQ
Q: Are you factory?
A: Yes, we are factory.
Q: How is your quality?
A: We have top grade production equipment and precision measuring instruments and we also have engineers and technicians          carry out quality control.
Q: Can you supply free samples?
A: 1kgs free sample is available, but freight charges will be at your account, The charges will be  return to you or deduct from your       order in the future.
Q: What about the payment?
     100% T/T in advance, 30% T/T in advance, the balance 70% against the B/L copy, Irrevocable L/C at sight
Q: The MOQ is?
A: MOQ is usually 1 ton, special products can be coordinuted with each other.
Q: Can I visit your factory?
A: Yes, we welcome you to visit our factory at anytime
Q: How about your delivery time?
A: Usually the shipm
ent is within 15 days after confirming receipt of your payment, some products maybe need longer time.

  



 

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