Customization: | Available |
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Active Ingredient Content: | Alumina |
Application: | Electronics, Electronics Industry |
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High Thermal Conductivity Filler Alumina
Overview: The product has spherical, near spherical and angular compact crystal structure, has good dispersion, good interface compatibility with organic polymer materials, can meet the requirements of high filling volume;The product has narrow particle size distribution, high chemical purity, good thermal conductivity and insulation performance, and the product quality has been recognized by customers at home and abroad.Items | AT-QX-5 | AT-QX-20 | AT-QX-45 | AT-QX-70 | AT-QX-90 | |
Chemical Data | SiO2(%)≤ | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 |
Fe2O3(%)≤ | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | |
NazO(%)≤ | 0.05 | 0.05 | 0.05 | 0.04 | 0.04 | |
Moisture(%) ≤ | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | |
Physical Data | Particle Size(um) | 5-6 | 18-22 | 45-50 | 70-80 | 90-110 |
a-phase(% ≥ |
30 | 40 | 50 | 60 | 70 | |
SBET(m2/g) | 1 | 0.8 | 0.5 | 0.3 | 0.3 | |
PH | 7.0-9.0 | 7.0-9.0 | 7.0-9.0 | 7.0-9.0 | 7.0-9.0 | |
Electrical Conductivity(μs/cm)≤ | 70 | 70 | 70 | 70 | 70 |